Say goodbye to the camera bump with this smartphone concept quoting : "PC World"

SEE ALSO: Oppo F3 Plus key specs leak; confirm dual selfie cameraWhile all this sounds interesting, Oppo has also just announced that it will be simultaneously launching its new dual selfie camera F3 Plus smartphone of F3 series across five markets on 23rd March 2017. The company is now putting them on the front of its new phone the F3 Plus. The F3 Series will take selfie technology to another level as well as it sets new trends. As per the company, this move comes as a way to offer the smartphone exclusively for the "Selfie Expert". So this new setup will help selfie lovers to capture high-quality images in a 16MP main camera and 8MP sub-camera.


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Engineers at Germany's Fraunhofer Institute have developed a smartphone camera module that's thin enough to be squeezed inside a smartphone, removing the need for a "camera bump" without compromising on quality. Martyn Williams A prototype camera image sensor unit developed by Fraunhofer Institute, on show at Mobile World Congress in Barcelona on February 28, 2017. It uses four image sensors rotated 90 degrees so they point out of the side of the phone. On most modern smartphones, the camera necessitates a bump on the back of the phone. Because the new-style image unit slides out from the side of the phone, users can be assured that when closed, the camera is physically incapable of taking pictures.


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collected by :Andro Alex