Say goodbye to the camera bump with this smartphone concept
Engineers at Germany's Fraunhofer Institute have developed a smartphone camera module that's thin enough to be squeezed inside a smartphone, removing the need for a "camera bump" without compromising on quality. Martyn Williams A prototype camera image sensor unit developed by Fraunhofer Institute, on show at Mobile World Congress in Barcelona on February 28, 2017. It uses four image sensors rotated 90 degrees so they point out of the side of the phone. On most modern smartphones, the camera necessitates a bump on the back of the phone. Because the new-style image unit slides out from the side of the phone, users can be assured that when closed, the camera is physically incapable of taking pictures.Sony Xperia XZs: 5.2-inch smartphone with IP68 certification, Snapdragon 820, 4GB RAM and an amazing 19MP-13MP camera
In fact, the design could be completely different from what we have been seeing in current Micromax smartphone lineup. As a part of its new business strategy, the premium smartphone may be priced between Rs 25,000 and Rs 30,000. Micromax, India's largest smartphone company has been quiet for the past few quarters. And if we have to go by the hint in the teaser, it could be Micromax's first smartphone to feature a dual-camera setup. Rumor mills also suggest that Micromax will be launching budget smartphones under a new 'Bharat' series.
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